Silicon is commonly used in infrared (IR) imaging systems. The surface quality is
an important issue in optics manufacturing since surface roughness affects optical
performance of imaging systems. Surface quality of an optical component is
determined by number of factor, including cutting parameters / cutting speed, depth
of cut and feed in radial direction.
In this thesis, an experimental study has been performed to investigate the relation
between cutting parameters and average roughness of the surface of silicon. In the
experiments, silicon specimens, which have a diameter of 50 mm, were face turned
by using a 2-axis CNC single point diamond turning machine. The specimens were
machined by using either constant spindle speed or constant cutting speed. Two
different tools with rake angles of -15 degrees and -25 degrees were used. The
attained surfaces were measured by using a white light interferometer, which has a
resolution of 0.1nm.
The experiments were designed according to the factorial design method,
considering cutting parameters. The effects of cutting parameters and tool rake
angles on surface quality of silicon were observed. The best average surface
roughness obtained was about 1 nm which is quite better than the acceptable
average surface roughness level of 25 nm.
| Identifer | oai:union.ndltd.org:METU/oai:etd.lib.metu.edu.tr:http://etd.lib.metu.edu.tr/upload/2/12609235/index.pdf |
| Date | 01 January 2008 |
| Creators | Cali, Serdal |
| Contributors | Gokler, Mustafa Ilhan |
| Publisher | METU |
| Source Sets | Middle East Technical Univ. |
| Language | English |
| Detected Language | English |
| Type | M.S. Thesis |
| Format | text/pdf |
| Rights | To liberate the content for METU campus |
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