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study of MEVVA-implanted copper and nickel in fused silica =: 通過金屬蒸氣眞空弧放電子源把銅和鎳注入熔融石英的硏究. / 通過金屬蒸氣眞空弧放電子源把銅和鎳注入熔融石英的硏究 / A study of MEVVA-implanted copper and nickel in fused silica =: Tong guo jin shu zheng qi zhen kong hu fang dian zi yuan ba tong he nie zhu ru rong rong shi ying de yan jiu. / Tong guo jin shu zheng qi zhen kong hu fang dian zi yuan ba tong he nie zhu ru rong rong shi ying de yan jiu

by Kong Lim Pun. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2000. / Includes bibliographical references. / Text in English; abstracts in English and Chinese. / by Kong Lim Pun. / ABSTRACT --- p.i / 摘要 --- p.iii / ACNOWLEDGEMENT --- p.iv / TALE OF CONTENTS --- p.v / LIST OF FIGURES --- p.ix / LIST OF TABLES --- p.xi / Chapter CHAPTER 1 --- Introduction / Chapter 1.1 --- Nanoparticles and nanostructural materials --- p.1 / Chapter 1.2 --- Materials of copper-implanted and nickel-implanted fused silica --- p.4 / Chapter 1.2.1 --- Overview --- p.4 / Chapter 1.2.2 --- Formation of nanoparticles --- p.5 / Chapter 1.2.3 --- Optical properties of the material --- p.9 / Chapter 1.3 --- Goals of the project --- p.12 / Reference --- p.13 / Chapter CHAPTER 2 --- Background of Study / Chapter 2.1 --- Introduction --- p.15 / Chapter 2.2 --- Optical absorption of metal nanocluster composite glasses --- p.16 / Chapter 2.2.1 --- Dielectric constant --- p.16 / Chapter 2.2.2 --- The features of surface plasmon resonance peak --- p.16 / Chapter 2.3 --- Third-order optical nonlinearity of metal nanocluster composite glasses --- p.17 / Chapter 2.3.1 --- Classical field confinement --- p.19 / Chapter 2.3.2 --- Quantum confinement --- p.21 / Chapter 2.3.2.1 --- Intraband transitions --- p.21 / Chapter 2.3.2.2 --- Interband transitions --- p.22 / Chapter 2.3.2.3 --- Hot-electron transitions --- p.22 / Chapter 2.4 --- Preparation Methods of MNCG(s) --- p.23 / Chapter 2.4.1 --- Ion implantation --- p.23 / Chapter 2.4.2 --- Ion exchange --- p.23 / Chapter 2.4.3 --- Sputtering deposition --- p.24 / Chapter 2.4.4 --- Melt -quenching and heat-treatment processes --- p.25 / Chapter 2.4.5 --- Ion-beam assisted deposition --- p.25 / Chapter 2.5 --- Applications --- p.25 / Reference --- p.27 / Chapter CHAPTER 3 --- Instrumentation / Chapter 3.1 --- Introduction --- p.29 / Chapter 3.2 --- Metal Vapour Vacuum Arc (MEVVA) ion source implantation --- p.29 / Chapter 3.2.1 --- Background of MEVVA ion source --- p.29 / Chapter 3.2.2 --- Characteristics of MEVVA ion source --- p.32 / Chapter 3.2.3 --- Implantation conditions --- p.33 / Chapter 3.3 --- X-ray photoelectron spectroscopy --- p.34 / Chapter 3.3.1 --- Theory --- p.34 / Chapter 3.3.2 --- Qualitative analysis --- p.38 / Chapter 3.3.2.1 --- Chemical shift peaks --- p.40 / Chapter 3.3.2.2 --- Auger peaks --- p.40 / Chapter 3.3.2.3 --- Energy loss peaks --- p.40 / Chapter 3.3.3 --- Quantitative analysis --- p.41 / Chapter 3.3.3.1 --- Homogeneous system --- p.41 / Chapter 3.3.3.2 --- Determination of layer thickness --- p.45 / Chapter 3.3.4 --- Instrumental components of XPS --- p.47 / Chapter 3.3.4.1 --- Sample introduction system --- p.47 / Chapter 3.3.4.2 --- X-ray source --- p.49 / Chapter 3.3.5 --- Application to metal nanoclusters composite glasses --- p.49 / Chapter 3.3.5.1 --- Compositional analysis --- p.50 / Chapter 3.3.5.2 --- Depth profiling --- p.50 / Chapter 3.3.5.3 --- Auger parameter --- p.50 / Chapter 3.4 --- Transmission electron microscopy --- p.53 / Chapter 3.4.1 --- Basic instrumentation of TEM --- p.53 / Chapter 3.4.2 --- Preparation of TEM cross section specimen --- p.54 / Chapter 3.4.2.1 --- Cutting --- p.54 / Chapter 3.4.2.2 --- "Disc-cutting, grinding, dimpling " --- p.54 / Chapter 3.4.2.3 --- Ion beam thinning --- p.56 / Chapter 3.4.3 --- Image contrast of TEM --- p.56 / Chapter 3.4.4 --- Basic operations of TEM --- p.57 / Chapter 3.4.4.1 --- Bright field and dark field images --- p.57 / Chapter 3.4.4.2 --- Selected area diffraction (SAD) --- p.58 / Chapter 3.4.4.3 --- Convergent Beam Electron Diffraction --- p.59 / Reference --- p.60 / Chapter CHAPTER 4 --- Composition and Nano structure of Copper-implanted Fused Silica / Chapter 4.1 --- Introduction --- p.62 / Chapter 4.2 --- The Atomic Distribution and Chemical State of Copper Nanocluster --- p.64 / Chapter 4.3 --- TEM Studies of Copper Nanoclusters --- p.70 / Chapter 4.4 --- Theoretical Calculation on Ratio of Surface to Bulk Atoms of Copper Nanocluster --- p.73 / Chapter 4.5 --- Conclusions --- p.74 / Reference --- p.77 / Chapter CHAPTER 5 --- Composition and Nanostructure of Nickel-implanted Fused Silica / Chapter 5.1 --- Introduction --- p.79 / Chapter 5.2 --- The distribution of nickel nanoclusters --- p.80 / Chapter 5.3 --- TEM studies of nickel nanoclusters --- p.81 / Chapter 5.4 --- Chemical state of nickel clusters --- p.87 / Chapter 5.5 --- Discussion --- p.90 / Chapter 5.6 --- Conclusion --- p.90 / Reference --- p.92 / Chapter CHAPTER 6 --- Conclusions --- p.94

Identiferoai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_323238
Date January 2000
ContributorsKong, Lim Pun., Chinese University of Hong Kong Graduate School. Division of Chemistry.
Source SetsThe Chinese University of Hong Kong
LanguageEnglish, Chinese
Detected LanguageEnglish
TypeText, bibliography
Formatprint, xi, 95 leaves : ill. ; 30 cm.
RightsUse of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/)

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