This work deals with flushing monitoring of spreading velocity on solder finishes Niau, OSP, Sn deposited on copper plated base material FR4 using digital cameras. After the reflow process is measured by length of spreading solder and size of wetting angle. It evaluates and compares the time dependence of velocity of spreading solder, length of solder spreading and wetting angle for NiAu, OSP, Sn finishes at different temperatures reflow and surface treatment.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:219522 |
| Date | January 2012 |
| Creators | Růžička, Miroslav |
| Contributors | Dušek,, Karel, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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