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Wire bond and Tin Whisker study on IC package

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Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0702102-154839
Date02 July 2002
CreatorsWang, jack
ContributorsGan, Der shin, Hsieh, Ker-Chang, Tseng, Bae-Heng
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0702102-154839
Rightsnot_available, Copyright information available at source archive

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