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Optimalizace ultrazvukového procesu kontaktování mikrospojů / Optimalization of ultrasonic interconnection

The thesis summarizes the basic knowledge of Wirebonding. It also closely studying the various influences on the final shape, strength and reliability of the bonds. In the experimental part are found the optimal settings of various wire bonders. For wire bonder TPT HB-10 are found the optimal settings for different types of surfaces, which were contacted.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:219221
Date January 2011
CreatorsGregor, Pavel
ContributorsHejátková, Edita, Buršík, Martin
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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