This research presents an analysis of low cost fabrication techniques for embedded thin film resistors suitable for large volume needs. High frequency applications are targeted from 2 to 40GHz. Two approaches are taken. The first utilizes commercially available foils to produce resistors using only thermocompression bonding and
wet chemical etching. The second method utilizes electroless plating with a modified plasma treatment to promote adhesion to organic materials. This process uses only chemical baths to form the thin films. Several RF and millimeter wave applications using these processes have been explored including terminations and attenuators. Accurate simulations of resistor performance were
obtained using impedance boundaries in conjunction with the finite element method. Resistors created using the foil transfer process are measured to be accurate within 5% of these simulated values. Electroless values are currently accurate to around 40%, with research underway expected to improve this to around 10%.
| Identifer | oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/14022 |
| Date | 21 November 2006 |
| Creators | Horst, Stephen Jonathan |
| Publisher | Georgia Institute of Technology |
| Source Sets | Georgia Tech Electronic Thesis and Dissertation Archive |
| Language | en_US |
| Detected Language | English |
| Type | Thesis |
| Format | 2047775 bytes, application/pdf |
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