Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications

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1. http://hdl.handle.net/1853/19506
2. 496293

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/19506
Date	08 1900
Creators	Pike, Randy T.
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis
Rights	Access restricted to authorized Georgia Tech users only.