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Pattern recognition for automated die bonding

published_or_final_version / Electrical Engineering / Master / Master of Philosophy

  1. 10.5353/th_b3120644
  2. b3120644
Date January 1982
Creators曾昭明, Tsang, Chiu-ming.
PublisherThe University of Hong Kong (Pokfulam, Hong Kong)
Source SetsHong Kong University Theses
Detected LanguageEnglish
RightsThe author retains all proprietary rights, (such as patent rights) and the right to use in future works., Creative Commons: Attribution 3.0 Hong Kong License
RelationHKU Theses Online (HKUTO)

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