Abstract
For the requirements of high-speed signal transmission has been increasing in the optical communication system ,so the fiber array in the communication system has a lot of advantages which can not be replaced. But the loss of coupling efficiency is a difficult problem as the distance of communication is getting longer and longer. The packaging quality of the fiber array module. In order to increase the transmission and the coupling efficiency, we produce the high precision to reach the goal.
This paper use adhesive bonding technology to packageing of the fiber array module. But the adhesive had shrinkage and strength two problem. This paper presents a novel height and strength control strategy is constructed to fabricate one-dimensional optical fiber array. For the height,a active-alignment technique is used and shrinkage control and pick adhesive parameter can improve accuracy to displacement distance is below 1£gm in the work tempeture.For the strength of the adhesion¡Aa way to use different kind temperature in the work can add adhesion's strength. After work use to replace temperature in order to add strength.
All the improvements of the above packading technologies are proposed to raise or keep the performance of the fiber array module.So,the error between theories and experiments can be minimized.Meanwhile,a high stability and repeatability of the packaging can be achieved due to the automation of the
positioning force sensing,andinspection.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0112109-235714 |
| Date | 12 January 2009 |
| Creators | Wang, Chu-fa |
| Contributors | Wei-huang Lin, Yih-tun Tseng, Che-hsin Lin, Cheng-tang Pan |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0112109-235714 |
| Rights | not_available, Copyright information available at source archive |
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