Majority of traditional assembly packaging are applied in consumer electronics and communication products. Electrical signals are transmitted through gold wire connecting IC and inner leadframe. The assembled product is then mounted to PCB board via outer lead. However, products with complicated functions require new development on advanced IC packaging solution that makes low market demand for traditional process. Therefore, assembly package cost reduction is the first target to keep the advantages of the products and make it profitable.
In this thesis, the feasibility on leadframe design from small matrix (2 row) to large matrix was analyzed making high volume throughput by increasing the totally unit quantity in one strip leadframe. With the introduction of the new strip outline dimensions, the staging time increases at wire bonder machine resulting to copper layer delamination. Appropriate control on the preheat temperature resolved the copper layer delamination issue. Assembly package for large leadframe design was then proposed and the capacity of machine was surveyed. The benefit of product cost saving and the increase on assembly yield for the enlarged leadframe are evaluated accordingly.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0118108-150134 |
| Date | 18 January 2008 |
| Creators | Chang, Che-Chin |
| Contributors | Chehsin Lin, Tai-Fa Young, Yuang-Cherng Chou |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0118108-150134 |
| Rights | not_available, Copyright information available at source archive |
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