Abstract
Equal channel angular extrusion (ECAE) has been used to investigate the formation of submicron grain structures in copper deformed to ultra-high plastic strains by different die angles, deformation routes, and deformation temperatures. The result was characterized by the use of transmission election microscopy (TEM), and the evolution of the deformed Cu depended on several parameters such as die angle, deformation route, and deformation temperature. It has been demonstrated that the most effective method of forming high angle boundaries and recrystallized grains by severe plastic deformation is to rotate billets with a constant clockwise 90o between each pass (route BC) via a 90o die angle. Besides, the temperature effect on the microstructural evolution is studied. With increasing deformation temperature, the microstructure becomes more homogeneous because the climb and the cross-slip of dislocations are easier at higher temperatures, and the fraction of high angle boundaries, recrystallized grains and size of them are increased significantly with the deformation temperature. In addition, the thermomechanical process was also investigated in the present work. It is suggested that a uniform submicron grained structure could be obtained by increasing the deformation temperature and decreasing the intermediate annealing temperature to promote dynamic recovery and to inhibit discontinuous recrystallization.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0621100-130459 |
| Date | 21 June 2000 |
| Creators | Huang, Wen-Hsien |
| Contributors | Chi-Lung Lee, L. Chang, Der-Shin Gan, J. Chih-Ching Huang, Chun-Wei Yeh |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0621100-130459 |
| Rights | unrestricted, Copyright information available at source archive |
Page generated in 0.0025 seconds