Thermal fatigue failure, due to the fracture of solder bumps which was cased by the coefficient of thermal expansion mismatch deformation, is frequently encountered in flip-chip package. Therefore, this thesis attempts to study the effects of geometric parameters variation on lead-free flip-chip package under temperature cycling test. First, we used the finite element method to simulate the thermal loading response of lead-free flip-chip. The accumulated equivalent creep strain and accumulated creep strain energy density of the lead-free solder bumps were calculated, and were used to predict the thermal fatigue life of lead-free flip-chip package. The Taguchi method is applied to obtain the optimal design parameters in order to enhance reliability of the lead-free flip-chip under temperature cycling loading. The analysis of variance (ANOVA) is also used for estimating the influence of the factors quantitatively. The obtained results can be adopted as references for the lead-free flip-chip package design.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0628107-145646 |
| Date | 28 June 2007 |
| Creators | Tsai, Chin-chieh |
| Contributors | none, Chien, Chi-Hui, none, none, none |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0628107-145646 |
| Rights | unrestricted, Copyright information available at source archive |
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