The work aims to manufacture AS-4/PEEK APC-2 nano-composite laminates first. We used the prepreg form of AS-4 Graphite/PEEK laminae to make APC-2 laminates of 2 mm thick with two lay-ups of cross-ply and quasi-isotropic totally 16 plies by a hot press via the modified diaphragm curing. The nano-particles SiO2 with the average diameter of 15¡Ó5 nm were uniformly spread in the specific interfaces of laminate. From mechanical testing it is found that the nanocomposite specimens of spreading 10 plies nanoparticles (3% by wt. of matrix) possesses the highest mechanical properties. we see that in cross-ply specimens the ultimate strength increases 10.91 % and stiffness 6.7 %; while in quasi-isotropic specimens the ultimate strength increases 12.48 % and stiffness 19.93 %.
Second, repeat the tensile tests at 50, 75, 100, 125, 150¢J to receive respective stress-strain curve , strength and stiffness. At elevated temperatures the ultimate strength decreases slightly below 75¢J and the elastic modulus reduces slightly below 125¢J, however, both properties degrade highly at 150¢J ( Tg) for two layups generally.
Finally, the constant stress amplitude tension-tension cyclic testing was conducted. It is found that both the stress-cycles (S-N) curves are very close below 104 cycles for cross-ply laminates w/wo nanoparticles, and the S-N curve of nano-laminate slightly bent down after 105 cycles. Whilst in quasi-isotropic laminates, the S-N curve of nano-laminate is always slightly below that of APC-2 laminate through the life.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0707104-164603 |
| Date | 07 July 2004 |
| Creators | Wu, Chun-Hsien |
| Contributors | Ming-Hwa R.Jen, Huang-Kuang Kung, Chen, Ming, J. Chih-Ching, Huang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0707104-164603 |
| Rights | not_available, Copyright information available at source archive |
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