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Packaging of 2.5 Gb/s Directly-Modulated Non-AR Coated Fiber Grating External Cavity Laser

This study proposes a low cost potentiall with non-AR coated fiber grating external cavity laser (FGECL) module to apply the metro/access network.
The components inside the module include uncoated FP (Fiber-Perot) laser chip, PIN detector, substrate, and cooler. The processes of package are following: (1) to utilize the die-bonder to fix the FP laser and the PIN detector on the substrate, (2) to utilize the heating apparatus to make the cooler fixed on the butterfly housing and the substrate fixed on the cooler, (3) to utilize the 353ND paste to make the thermistor fixed on the substrate, and (4) to utilize the electrothermal heating machine to melt indium wire and then adjust the fiber lens provided with higher coupling efficiency of fiber pigtail by tweezer to couple light into the fiber inside the butterfly housing.
This study achieves a FGECL module with the output power of larger than 2mW and the side-mode suppression ratio (SMSR) of more than 38dB. Finally, we measure eye diagram and bit-error-rate at 2.5Gb/s of the FGECL module to analyze the impedance matching of laser diode, current signal and the limit of the dispersion to the optical communication system. The performance of the FGECL module can meet the ITU-T G.957 standard.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0707104-214700
Date07 July 2004
CreatorsWang, Shih-Hung
ContributorsTsong-Sheng Lay, Tien-Tsong Shih, Wood-Hi Cheng, Ching-Ting Lee, Sheng-Lung Huang
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0707104-214700
Rightscampus_withheld, Copyright information available at source archive

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