The device produced by IC planar process only shows in 2D, therefore, many applications may be limited. When adopted the micro hinge and self-assembly of surface micro machining technology, 3D micro structure is coming true. Even though , it¡¦s hard to applied on micro fan this kind of producing continuous steps, further problem is waiting to solve. The traditional micro fan technology using surface tension power of the solder ball to carry out the purpose of self-assembly. Currently the diameter of solder ball smaller than 100£gm is fairly difficult, using photosensitive polyimide to form a elastic joint replaces the solder ball, that slashes micro fan size. Therefore PI has very good property resisting organic solvent, hence it¡¦s quiet suitable for using wet release, so that to achieve the purpose of cost down, process integrated and reducing the complex of process.
Through the experiment, the optimal recipe has been done. Micro blade has raising to 45¢X, blade area can reach 200£gm¡Ñ200£gm, yield is over 50%. After observation, the key process is reflow temperature of polyimide thin film being micro structure joint, reflow temperature over 405¢J will result in thin film shrinking strongly, and that is unable to raise blade successfully.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0719105-095054 |
| Date | 19 July 2005 |
| Creators | Wang, Chih-Hung |
| Contributors | none, none, none, I-Yu Huang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0719105-095054 |
| Rights | not_available, Copyright information available at source archive |
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