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Bubble formation during solidification of a liquid film

Surface patterns of bead defects such as humping, gouged and rippling after solidification during laser and electron processing and different welding processes are systematically and quantitatively studied in this project. These defects usually accompanying with porosity, undercut, segregation, stress concentration, etc. seriously reduce the properties and strength of the surface heat treatment and weld joint. In order to improve quality, assure mass production and repeatability and reduce costs, it is necessary to understand their mechanisms. Although the defects have been extensively studied in the past, systematical, penetrative and quantitative understanding of their formation from thermal, physics, and pattern selection viewpoints are limited.The study include thermocapillary force, evaporation, and phase changes between solid-liquid and liquid-gas phases by introducing energy equation and interfacial and kinematic boundary conditions to simulate realistic processes.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0720111-210718
Date20 July 2011
CreatorsLin, Chun-Yen
ContributorsJiin-Yuh Jang, Fei-Pin Hsiao, Long-Jong Chen, Peng-Sheng Wei
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720111-210718
Rightsrestricted, Copyright information available at source archive

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