The residual stress distribution, growth of Intermetallic Compound (IMC) layer and the equivalent strength in the Laser diode package are investigated in this thesis. The redistribution of residual stress in the solder layer is calculated by employing the MARC finite element package. The effects of residual stresses and IMC layer on the bonding strength of Laser diode under taken different thermal load cycles are studied. Numerical results are compared with the results measured experimentally. Results indicate the effect of residual stresses introduced in the solder solidification is so important in the stress analysis of a solder joint. The effects of different solder parameters, i.e, solder alloy, solder layer thickness and the number of thermal load cycles, are also analyzed in this work.. A better understanding about the solder bond strength is expected from this analysis.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0728100-133523 |
| Date | 28 July 2000 |
| Creators | Fu, Chang-Chia |
| Contributors | Kuang-Jao Hwa |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0728100-133523 |
| Rights | unrestricted, Copyright information available at source archive |
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