In high-speed digital circuits, in order to utilize the space of printed circuit boards efficiently, the signal via is a heavily used interconnection structure to communicate different signal layers. However, the interconnection discontinuities will result in the degradation of the signal integrity and become a crucial issue for IC designers. To analyze the problems accurately and fast using the hybrid physical equivalent model which combining the transmission line model, slot model, via model, and decoupling capacitor model, etc. Based on the method, we can get a good result of simulation and compute faster than Ansoft HFSS. In addition, by the hybrid physical model method, we simulate and discuss several interesting issues such as resonance in power/ground planes, and the effect of the simultaneous switching noise, we also improve the bad effect of the printed circuit boards existing vias by some ways.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0804108-181703 |
| Date | 04 August 2008 |
| Creators | Tien, Tsung-Yin |
| Contributors | Tzyy-Sheng Horng, Chie-In Lee, Chih-Wen Kuo, Ken-Huang Lin |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804108-181703 |
| Rights | not_available, Copyright information available at source archive |
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