The current packaging trend toward smaller and thinner package has pushed the manufacturing technology to the limit. Due to fast development of encapsulation technology, the need for shortening factory time and upgrading technological ability are vital to promote companys¡¦ competitiveness. Most of IC packing factory are expanding resources to adapt on the technology development needs. Technology transfer methods are utilized to effectively cope with the technology trend.
This research takes technology suppliers, characters of the technology and receivers of technology as three major independent variables. In other words, the negative effect of the absorptive capacity can be reduced effectively by using proper technology transfer mechanism and thus achieving satisfactory performance. In the technology transfer process , in-depth factors other than existing procedures and rules are considered. This will affect the effectiveness and goals of the transfer. Besides, the technology characteristics and technology transfer performance are related to each other. The knowledge and ability to technology transfer with shorter gap between technology provider and accepter, help developing new products and improving management process with consolidated firm competitiveness and has become the significant theme of the 21st century.
Keyword: Technology transfer¡BIC Package
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0819104-144000 |
| Date | 19 August 2004 |
| Creators | Lin, Cheng-Nan |
| Contributors | Jao-Hwa Kuang, Inn-chyn Her, Chi-Cheng Cheng |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0819104-144000 |
| Rights | campus_withheld, Copyright information available at source archive |
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