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Compiler/Hardware Codesign and Memory Management for a Novel 3D Graphics Processor

This thesis is part of a large, multi-laboratory project to develop a GPU system-on-chip (SoC) for embedded systems. In support of this project, this current thesis presents the assembler and linker for the overall system. These tools were developed ¡§from scratch¡¨ for this project, because the both the input (to our assembler) and the output (from our linker) have new formats, due to the novelty of our GPU.
One of the challenges of the work in this thesis is the problem of memory management. Another is the problem of deciding upon an assembly format. But the largest challenge was in co-design. The assembler has to work with a compiler which is also under development by other students. Also, the machine instructions that we produce have to support the format and functionality of the GPU hardware. To accomplish this, the specific details of this hardware had to be rigorously defined through discussion and negotiation. Furthermore, the memory addresses also required codesign with the benchmark development team, which needs to have access to these memory locations. So codesign issues impacted many of the features of this thesis.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0908110-105326
Date08 September 2010
CreatorsTseng, Sheng-Chih
ContributorsChung-Nan Lee, Steve W. Haga, Shen-Fu Hsiao
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageEnglish
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0908110-105326
Rightsnot_available, Copyright information available at source archive

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