In this study, stress problems occurring in low tempera -ture cofired ceramic processes are analyzed by finite element package ANSYS. Sintering stresses of sintering processes and residue stresses in cooling processes are investigated. The thermal shrinkage coefficient are used to deal with the density variation due to the shrinkage mismatch between the green tape and silver paste in the sintering processes. Deleting the elements is used to treat the situation when the element stress exceeds its fracture stress. The residue stresses due to the mismatch of the thermal expansion coefficients in cooling processes are also discussed.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0911106-200903 |
| Date | 11 September 2006 |
| Creators | Jhou, Pei-jia |
| Contributors | none, none, none, Y-M Hwang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0911106-200903 |
| Rights | off_campus_withheld, Copyright information available at source archive |
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