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The Study of Microstructure Analysis of Pb/Sn And Sn/Ag/Cu Solder Ball in BGA Package.

The Study of Microstructure Analysis of Pb/Sn And Sn/Ag/Cu Solder Ball in BGA Package.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-1204101-061207
Date04 December 2001
CreatorsCHI, Chin-Shu
ContributorsKer-Chang Hsieh, Der-Shin Gan, Bae-Heng Tseng
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1204101-061207
Rightsnot_available, Copyright information available at source archive

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