Return to search

Characterization of copper diffusion in advanced packaging /

Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 134-144). Also available in electronic version.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/123259853
Date January 2007
CreatorsZhang, Xiaodong.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceView abstract or full-text.

Page generated in 0.0019 seconds