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Rework of lead-free area array packages assembled on ultra-thin flexible substrates

Thesis (M.S.)--State University of New York at Binghamton, Industrial and Systems Engineering Dept., 2007. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/304341908
Date January 2007
CreatorsChennagiri, Gurudutt.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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