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Stress and microstructure of sputter deposited thin copper and niobium films

Zugl.: Stuttgart, Univ., Diss., 2003.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/314259891
Date January 2003
CreatorsOkolo, Brando Chidi,
Publisher[S.l. : s.n.],
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeOnline-Publikation.

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