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Study of thermal and chemical factors which influence solidification of tin in near eutectic Sn-3.0Ag-XCu lead free solder

Thesis (M.S.)--State University of New York at Binghamton, Materials Engineering Dept., 2006. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/316226824
Date January 2006
CreatorsXing, Yan.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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