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Automatic visual inspection of placement of bare dies in multichip modules /

Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 95-96).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/31717726
Date January 1994
CreatorsChheda, Mahesh.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceOnline version of thesis

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