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A wafer-thick trench isolation technology for automotive PIC applications /

Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (p. 69-73).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/359673721
Date January 2009
CreatorsSun, Jingmeng.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceView abstract or full-text.

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