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Materials study for interfacial adhesion and reliability of microelectronics packaging structures /

Thesis (Ph. D.)--University of Texas at Austin, 1998. / Vita. Includes bibliographical references (leaves 154-163). Available also in a digital version from Dissertation Abstracts.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/44477351
Date January 1998
CreatorsDai, Xiang,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceDigital version accessible at:

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