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Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures

Thesis (Ph. D.)--University of Texas at Austin, 2001. / Vita. Includes bibliographical references. Available also from UMI Company.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/50805162
Date January 2001
CreatorsRhee, Seung-hyun.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAccess restricted to users with UT Austin EID Full text (PDF) from UMI/Dissertation Abstracts International

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