Steam driven delamination in electronics packages /

Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2002. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/51092725
Date January 2002
CreatorsChong, Iok Tong.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceView Abstract or Full-Text.

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