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Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips

Thesis (M.S.)--Materials Science and Engineering, Georgia Institute of Technology, 2005. / Suresh, Committee Member ; C.P. Wong, Committee Member ; Rao R. Tummala, Committee Chair. Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/57466877
Date January 2004
CreatorsGupta, Piyush.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology, 2004:

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