Statistical analysis of electromigration lifetimes and void evolution in Cu interconnects

Description

Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Paul S. Ho. Vita. Includes bibliographical references.

Links & Downloads

1. http://repositories.lib.utexas.edu/bitstream/handle/2152/1562/hauschildtm39810.pdf

Tags

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/61224527
Date	January 2005
Creators	Hauschildt, Meike. Ho, P. S.
Source Sets	OCLC
Language	English
Detected Language	English