Experimental study of void formation in solder joints of flip-chip assemblies

Description

Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Ronald L. Panton. Vita. Includes bibliographical references.

Links & Downloads

1. http://repositories.lib.utexas.edu/bitstream/handle/2152/1754/wangd48141.pdf

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/62110547
Date	January 2005
Creators	Wang, Daijiao, Panton, Ronald L.
Source Sets	OCLC
Language	English
Detected Language	English