A systems approach to reduce processing and materials induced warpage in large single ply PCB cores

Description

Thesis (Ph. D.)--State University of New York at Binghamton, Systems Science Dept., 2005. / Includes bibliographical references.

Links & Downloads

1. http://proxy.binghamton.edu/login?url= http://wwwlib.umi.com/dissertations/fullcit/3164699.

Tags

Printed circuits

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/75178834
Date	January 2005
Creators	Kayande, Sarang.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Web sites. Electronic dissertations.
Source	Online access via UMI: