Role of intermetallics for both tin-lead and lead free solder structures and its solder pad combination

Description

Thesis (M.S.)--State University of New York at Binghamton, Mechanical Engineering Dept., 2005. / Includes bibliographical references.

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1. http://proxy.binghamton.edu/login?url= http://wwwlib.umi.com/dissertations/fullcit/1432314.

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/75487663
Date	January 2005
Creators	Iyer, Ganesh R.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Web sites. Electronic dissertations.
Source	Online access via UMI: