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Compact thermal modeling for 3D IC design

Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Electrical Engineering), 2005. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/75488127
Date January 2005
CreatorsLi, Xiaoming,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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