Application of controlled thermal expansion in diffusion bonding for the high-volume microlamination of MECS devices

Description

Graduation date: 2005

Links & Downloads

1. http://hdl.handle.net/1957/30100

Tags

Microfluidic devices

Microfluidics

Diffusion bonding (Metals)

Microlamination

Additional Fields

Identifer	oai:union.ndltd.org:ORGSU/oai:ir.library.oregonstate.edu:1957/30100
Date	10 September 2004
Creators	Pluess, Christoph
Contributors	Paul, Brian K.
Source Sets	Oregon State University
Language	en_US
Detected Language	English
Type	Thesis/Dissertation