A new second order accurate nonuniform grid spacing technique which does not
depend on supraconvergence is developed for Finite Difference Time Domain (FDTD)
simulation of general three dimensional structures. The technique is useful for FDTD
simulations of systems which require finer details in small regions of the simulation space by
providing the ability to utilize nonuniform grid spacing. The stability conditions of the new
technique are derived and shown to be consistent with uniform grid formulation and the
accuracy of the technique is investigated and shown to be second order. The advantage of
the new technique is that it allows for greater simulation detail while reducing the
computational and memory requirements compared to the current uniform grid FDTD
techniques.
Additionally, the derivation of the expressions associated with the inclusion of material
properties in the FDTD simulation with nonuniform grids is presented allowing for the
development of a nonuniform FDTD simulator for general lossy 3D systems associated
with on and off chip interconnects, electronic packages and microwave circuits. In order to
illustrate the utility of this simulator, time domain electromagnetic simulation of a 3-D lossy
interconnect structure associated with a generic surface mount IC package is presented.
The time domain currents and fields are computed in the structure to investigate ground
bounce, signal degradation, and crosstalk associated with the interconnects and packaging
structure. The supply plane conductivities are included in the simulation allowing the
observation of the current densities in the power/ground planes as a function of time.
Finally, the FDTD simulation tool is proposed and used as a Virtual TDR (V-TDR) to
extract the circuit models associated with complex 3D structures. The time domain
response of a multiport structure is used to extract the equivalent circuit parameters to
characterize the multiport by using the multiport time domain reflection (TDR) based
general deconvolution algorithm. Examples of coupled interconnects and transmission
lines are presented to illustrate this technique. / Graduation date: 1997
| Identifer | oai:union.ndltd.org:ORGSU/oai:ir.library.oregonstate.edu:1957/34212 |
| Date | 23 January 1997 |
| Creators | Falconer, Maynard C. |
| Contributors | Tripathi, Vijai K. |
| Source Sets | Oregon State University |
| Language | en_US |
| Detected Language | English |
| Type | Thesis/Dissertation |
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