Chemical microreactors offer opportunities for portable power generation, on-site
waste remediation and point-of-use chemical synthesis. Much of the existing
development of microreactor devices involves silicon-based microfabrication techniques.
It is recognized that new refractory materials are important to realizing high-temperature
microreactors. Requirements of these materials include high-temperature resistance,
chemical inertness and low-cost microfabrication. Advances in multilayer ceramics hold
promise for the fabrication of microreactor structures from ceramic tape. Problems
include creep, moderate levels of densification, and volumetric shrinkage, all of which
can lead to dimensional instability.
Intermetallics are another class of refractory materials which may hold some
promise for high-temperature microreactor development. In this paper, a new method of
forming microchannel arrays from thin layers of intermetallics is demonstrated. This
method has the advantage of eliminating volumetric shrinkage due to binder removal.
Various iterations of NiAl intermetallic conversion and bonding are presented. Results show that the NiAl system may be suitable as a substrate for microchannel reactor
designs. / Graduation date: 2002
| Identifer | oai:union.ndltd.org:ORGSU/oai:ir.library.oregonstate.edu:1957/34754 |
| Date | 05 September 2001 |
| Creators | Dewey, Tyler |
| Contributors | Paul, Brian K. |
| Source Sets | Oregon State University |
| Language | en_US |
| Detected Language | English |
| Type | Thesis/Dissertation |
Page generated in 0.0028 seconds