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Modeling, Simulations, and Parametric Studies of the Dip Coating Process with the Effect of Solvent Evaporation Rate and Bulk Reaction Rate

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Identiferoai:union.ndltd.org:OhioLink/oai:etd.ohiolink.edu:akron1222359806
Date January 2008
CreatorsJittavanich, Kotchanun
PublisherUniversity of Akron / OhioLINK
Source SetsOhiolink ETDs
LanguageEnglish
Detected LanguageEnglish
Typetext
Sourcehttp://rave.ohiolink.edu/etdc/view?acc_num=akron1222359806
Rightsunrestricted, This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.

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