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Low Percolation Threshold in Electrically Conductive Adhesives using Complex Dimensional Fillers

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1. http://rave.ohiolink.edu/etdc/view?acc_num=akron1542727822099192

Identifer	oai:union.ndltd.org:OhioLink/oai:etd.ohiolink.edu:akron1542727822099192
Date	January 2018
Creators	Taubert, Clinton J.
Publisher	University of Akron / OhioLINK
Source Sets	Ohiolink ETDs
Language	English
Detected Language	English
Type	text
Source	http://rave.ohiolink.edu/etdc/view?acc_num=akron1542727822099192
Rights	unrestricted, This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.