碩士 / 國立成功大學 / 工程科學系 / 87 / This study investigates the effects of pin-fin geometries and ambient temperature variations to the thermal performance of fins by measuring the temperature field of the fins. The temperatures are measured by thermal couples and infrared thermal imaging system. The thermal resistance is used to characterize the thermal performance of the fins.
The experiments are divided into two parts: actual CPU measurements and simulated heat source measurements. In measuring temperature from CPU, Intel Pentinum II(400 MHz) is the heat source. The thermal resistance shows two different results.
In measuring temperatures from a simulated heat source, two different ambient temperatures are examined; i.e.: room temperature(22.5℃±2.5℃) and a higher temperature(45℃±3℃). The thermal resistance is separated into internal and external parts. When the ambient temperature changes, the thermal performance of all fins is similar to the results of actual CPU experiment, but just has higher thermal resistance at higher ambient temperature. For external resistance, the results reveal that it is not affected by changes of ambient temperature. However, one of the fins has higher external thermal resistance than others in force convection. On the other hand, in natural convection, external thermal resistance and internal thermal resistance have the same trend.
| Identifer | oai:union.ndltd.org:TW/087NCKU0028061 |
| Date | January 1999 |
| Creators | Jiann Horng Chern, 陳建宏 |
| Contributors | J. H. Chou, 周榮華 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 71 |
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