碩士 / 國立臺灣科技大學 / 機械工程系 / 91 / Modern electronics have seen component heat loads increasing since advances in semiconductor process technology enable the industry to pack more performance into smaller packages. Thermal management issues are becoming more complex since while the heat being dissipated from these devices increases, the space available for heat dissipation decreases. This requires that the thermal management system be optimized to attain the highest performance in the given space. While adding fins to the heat sink increases surface area, it also increases the pressure drop. This reduces the air velocity and the associated heat transfer coefficient.
The primary goal of this paper is to find the optimization points for the type of heat sink with radial fins. The parameters considered in this study include: different heights of the blocking plate, different pitches, fin thicknesses, and fin numbers of the fin. Both numerical and experimental studies were employed in this study. The numerical study is done by using IcePak CFD modeling. One of the cases in the numerical study is compared with the experimental result, the agreement between theses two approaches is satisfactory.
| Identifer | oai:union.ndltd.org:TW/091NTUST489104 |
| Date | January 2003 |
| Creators | Chih-Hsin Chang, 張志新 |
| Contributors | Hong Jinn Ching, 洪俊卿 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 0 |
Page generated in 0.016 seconds