碩士 / 國立中興大學 / 機械工程學系 / 92 / Abstract
In this study, a computational fluid dynamics (CFD) package of Flotherm was used to investigate the thermal analysis of plate fins with variable thickness and constant height for an electronic module in laminar flow. The simulated parameters are two kinds of thermal conductivity (k=180W/m-K and 385 W/m-K) , two different aspect ratio of plate fins, and plate sharpness(a=0.1~1) so there are the analysis results of 40 sets shown in present analysis.
At the same Reynolds number and aspect ratio, the calculated results at various plate sharpness parameters(a=0.1~1) are shown. In the present study, We can find the optimum heat dissipation of base fin plate. At the same Reynolds number, k=180W/m-K, at the aspect ratio H/L=1/3, the heat dissipation of plate fin at plate sharpness a=0.8 is best; At the same Reynolds number, k=385W/m-K, at the aspect ratio H/L=1/3, the heat dissipation of plate fin at plate sharpness a=0.7 is best.At the same Reynolds number and material, at the aspect ratio H/L=1/3, the heat dissipation of the plate fin with variable thickness and constant height is superior to the plate fins with uniform thickness.
At the same Reynolds number and material, at the aspect ratio H/L=1/3, the heat dissipation of plate fin at plate sharpness a=1 is better than the others sharpness a=0.1~0.9.
| Identifer | oai:union.ndltd.org:TW/092NCHU0489076 |
| Date | January 2004 |
| Creators | Michael Liao, 廖文川 |
| Contributors | 莊書豪 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 60 |
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