碩士 / 華梵大學 / 機電工程研究所 / 94 / The aimed of this paper is to study the laser drilling technique with the water cooling-assistance for brittle substrates. The method can reduce the generation of the defects in the drilling hole relative to that of the conventional laser drilling in air. The lasers used were CO2 Laser and Nd:YAG Laser. The experimental materials were LCD Glass, alumina substrates, and silicon wafers. The substrates were immersed under water with a distance of 1mm. The quality of laser drilling for the laser parameters of power and frequency was studied. It can be found that the drilling quality of LCD glass and alumina substrate under water is much better than that from the conventional laser drilling. Underwater drilling could improve the phenomena created by non-water auxiliary technique, such as: micro-cracks and heat-affect-zone. Silicon wafer under water drilling could reduce the generation of molten slag; however, it triggered the bubble collapses around the hole. The under water drilling was applied to the trepanning single-hole drilling and matrix-hole drilling successfully. The minimum distance between the two neighbour holes that can be obtained is much shorter than that of drilling in air. The SEM photographs of the holes were obtained to analyze the drilling quality. Finally, the finite element software ANSYS was employed to calculate the temperature and stress distributions for the cases of laser drilling in air and under water.
| Identifer | oai:union.ndltd.org:TW/094HCHT0657019 |
| Date | January 2006 |
| Creators | Cheng-Chang Li, 李昌城 |
| Contributors | Chwan-Huei Tsai, 蔡傳暉 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 113 |
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