碩士 / 國立中興大學 / 機械工程學系 / 94 / The purpose of this experiment is to discuss the performance of the RHE thermal module. We will define 4 models to discuss. Type A is fin pitch 1.8mm (43 pieces)、Type B is fin pitch 1.8mm (29 pieces) and 2.1mm (12 pieces)、Type C is fin pitch 1.8mm (29 pieces) and 2.5mm (10 pieces)、Type D is fin pitch 1.8mm (15 pieces) and 1.575mm (16 pieces) and 2.1mm (12 pieces). The parameters of CPU heat transfer are 60W、70W、80W、90W and 100W.
According to the experiment’s results, we learned that the fin pitch is the critical factor that will influence thermal resistance and performance of the heat pipe. When the CPU is 60W, the regular arrangement of fins compared to irregular arrangement will result in 11~20% decrease of thermal resistance in the heat pipe. When the CPU is 100W, the thermal resistance of the heat pipe will decrease 22%~29%.
When the CPU is between 60W~90W, the slope of the heat pipe temperature curve changes gradually, meaning the heat transfer is under the limit of heat transfer. When the CPU is over 90W, the slope of the heat pipe temperature curve increases faster, the cause of this increase is that the capillarity can not bear the heat transfer, which we call heat pipe “dry out”.
| Identifer | oai:union.ndltd.org:TW/094NCHU0489008 |
| Date | January 2006 |
| Creators | Chien Long Yu, 尤金龍 |
| Contributors | Chuang Shu-Hao, 莊書豪 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 52 |
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