碩士 / 國立中興大學 / 機械工程學系 / 94 / Due to the miniaturization and the increased functionality of consumer electronics thermal requirements have become increasingly difficult. One solution is to move the heat from the microelectronics into an area or areas, within the enclosure, where there is more available space and or increased air flow. This can be accomplished very effectively with a Remote Heat Exchanger (RHE).
The purpose of this paper is to analyze the effects that the reflow oven has on the “press fit” interface joint between the fins and heat pipe(s). Due to the differences in the Coefficient of Thermal Expansion between copper and aluminum the reflow oven may cause permanent cracks in the aluminum fins during the reflow soldering process. This crack can cause a significant decrease in performance due to an increase in the thermal interface between the fins and the heat pipe(s).
This paper has analyzed the effects of the reflow oven on the “press fit” fins. Using “Taguchi Method” for design of experiments it has been determined that indeed there are negative ramifications to exposing the “press fit” fin assembly to the elevated temperatures of the reflow oven. The solution offered is to assemble the fins onto the heat pipe after all soldering has been completed.
| Identifer | oai:union.ndltd.org:TW/094NCHU0489010 |
| Date | January 2005 |
| Creators | Chiang Wei Chieh, 江偉杰 |
| Contributors | Chuang Shu Hao, 莊書豪 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 0 |
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