碩士 / 國立成功大學 / 工程科學系專班 / 94 / In recent years, the electronic components are continuously developing towards high performance and shrinking it’s size. But also more higher thermal energy also produced. Using heat sink is always the common heat dissipation method as we know. We usually use two kinds of cooling method with heat sink, that is natural convection and forced-air convection. But, among various cooling methods, water cooling system always have the best performance. The real advantage of water cooling system is that it always with low noise but able to handle much greater wattages from CPU than any air-cooler can.
In this article, we try to use water cooling method to compare with these two traditional air cooling methods with the same heat sink. Through the experiments to prove that there will be the same or even more higher heat dissipation rate even when we have a low flowing rate of coolant as we use water cooling method with heat sink. In other words, it’s a new idea if we use heat sink as the internal shape inside a water block . In order to prove this, heat sink had been installed into the water block and carried out an experiments.
The experiments results show that during the natural convection under heat generation rate at 15W from the heater and reach the equilibrium stage , the thermal resistance of the system was 1.71℃/W and the chip temperature was 107.1℃. Under forced-air convection at 15W at equilibrium stage and the wind speed at 2.4m/s , the thermal resistance was 1.95℃/W and the chip temperature was 58.8℃. Under water-cooling system at water flowing rate at 400L/hr and 15W at equilibrium stage, the thermal resistance was 0.85℃/W and chip temperature was 39.4℃. At water flowing rate at 100L/hr and 15W at equilibrium stage, the thermal resistance was 0.99℃/W and chip temperature was 43.4℃. Even when the water flowing rate decrease to 100L/hr at 15W in equilibrium stage , thermal resistance is 0.99/℃W and chip temperature was 43.4℃. It means 35% efficiency is higher than the air-forced convection at 15W equilibrium stage will be obtained.
Nevertheless, the most important result was even when the water flowing rate decrease from 400L/hr to 100L/hr at 80W, thermal resistance only increased 0.075℃/W. It means the flowing rate of water in this water cooling system was inconspicuous.
| Identifer | oai:union.ndltd.org:TW/094NCKU5028075 |
| Date | January 2006 |
| Creators | Yin-Yan Chan, 陳賢仁 |
| Contributors | Ming-Jer Huang, 黃明哲 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 66 |
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