碩士 / 國立成功大學 / 系統及船舶機電工程學系碩博士班 / 94 / This study reports a novel design of a MEMS type underwater acoustic sensor using 6”single-crystalline silicon wafer. At resonant frequent of the membrane structure , a high signal-to-noise ratio is expected by chemical vapor deposition thin layers of silicon nitride and poly-silicon , the sensing membrane and piezo-resistive material are patterned and etched using lithography and dry etching process, respectively. After the gold wire is patterned, the entire back side of the sensing membrane is etched in order to create the cavity by back-side etching. The waterproof of the hydrophone is completed by deposition a thin layer of Parylene polymer material. We have proven that the controlled etching process can create the sensing membrane without difficulties and have successfully made the acoustic sensor.
During sensor testing done in air and water, we can receive the frequency of acoustic
accurately. As the frequency of acoustic wave approaches the natural frequency of the sensor, the better frequency response of the sensor is obtained.
| Identifer | oai:union.ndltd.org:TW/094NCKU5345010 |
| Date | January 2006 |
| Creators | Hsieh-Yu Lee, 李協宇 |
| Contributors | Ru-Min Chao, 趙儒民 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 102 |
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